Techniques for connecting a lead to a conductor

ABSTRACT

A connector device is shaped or formed to include bendable flaps for securing one or more conductors when the flaps are crimped. Typically, the connector device includes a base having an external surface that is eventually affixed to a complementary shaped surface. Accordingly, a conductor can be attached to the complementary shaped surface. For example, one or more conductors can be crimped via the connector device, which is thereafter attached to a complementary surface.

RELATED APPLICATIONS

[0001] This application is a divisional of U.S. application Ser. No.10/176,946, filed Jun. 20, 2002, which claims the benefit of U.S.Provisional Application No. 60/302,087 filed Jun. 29, 2001. The entireteachings of the above applications are incorporated herein byreference.

BACKGROUND OF THE INVENTION

[0002] Creating a solder connection between a conductor such as abraided wire and a conductive node can be tedious, especially when theconductive node or underlying material is sensitive to extremetemperature. To create such a connection, a hot soldering iron isgenerally applied to the surface of the conductor and the conductivenode, forcing the two conductors in contact with each together. Heatfrom the hot solder iron tip flows through the material, increasing thetemperature of both conductors. After both conductors reach a desiredtemperature, a solder wire is typically provided in contact with the twoconductors and hot soldering iron. Upon contact, the solder melts andflows to fill the void between the conductors. After the area cools, asolid conductive solder contact bond remains, holding the two conductiveterminals together.

[0003] Unfortunately, the process of soldering a braided wire to aconductive node involves incidentally heating the underlying conductivesubstrate as well as the braided wire to extreme temperatures.Overheating the material underlying the conductive substrate can stressthe material creating a structural weak spot. This is particularly truewhen the material is sensitive to thermal exposure such as when thesubstrate is glass. Needless to say, structural weakening of thismaterial, or any material for that matter, is undesirable because itincreases the likelihood of a premature product failure.

[0004] The method of soldering a braid of wire to a conductive contactcan also be a cumbersome process. Soldering braided wire can requirethree hands: a first to direct the solder iron, a second to direct thesolder wire and a third to hold the braided wire in place. When only twohands are used, as is often the case, it is difficult to simultaneouslycontrol the direction of solder wire and hold the braided wire in placeusing only one hand. Hence, it is difficult to maneuver the solder wireto the desired area during the. soldering process. In addition, atechnician can miscalculate how long it takes to heat an area to besoldered. Overheating an area with a solder iron can stress theunderlying material.

SUMMARY OF THE INVENTION

[0005] One aspect of the present invention is directed towards a systemand method of securing conductors. In an illustrative embodiment, aconnector device is shaped to include bendable flaps for securing one ormore conductors such as a conductive strip and a lead wire. Theconnector device can include a base having an external surface that iseventually affixed to a complementary shaped surface. A portion of theconductor can also be attached to the complementary shaped surface.Accordingly, a conductor strip and connector device can be securelyfastened to the complementary shaped surface.

[0006] In one application, one or more conductors are crimped into theconnector device, which is attached to a complementary surface.

[0007] The connector device can be made from a strip of flat metal andcan be formed to include bendable flaps. A portion of the metal stripcan form the external surface that is eventually attached to acomplementary surface.

[0008] In another application, the external surface of the connectordevice is flat such that the external surface of the connector deviceand at least a portion of the conductor strip lie in a common plane forattachment to a complementary shaped surface such as a flat surface.

[0009] In yet another application, the connector device for crimpingconductors includes two or more sets of bendable flaps so that multipleconductors can be crimped together. For example, a first set of bendableflaps can be used to crimp a conductor such as a lead wire to theconnector device while a second set of bendable flaps can be used tocrimp yet another conductor to the connector device. Accordingly, two ormore conductors can be crimped to a common electrode such as theconnector device itself.

[0010] Although the connector device can be made of any suitablematerial such as an insulating material, it is optionally electricallyconductive. Thus, when the connector device is formed out of metal suchas copper, the external surface of the connector device can be solderedto a complementary shaped surface. The conductor strip is alsooptionally soldered to the complementary surface.

[0011] Another aspect of the present invention involves shaping theconnector device to include a tongue for attaching a lead wire. Forexample, the connector device can include a protruding extension towhich a lead wire can be removably or permanently attached. The tonguecan be formed or bent so that it rests above a complementary surface towhich the connector device is attached.

[0012] Another aspect of the present invention involves providing aconnector device having bendable flaps for securing one or moreconductors such as a conductor strip when the flaps are crimped. Theconductor strip can be a flat strip of metallic or conductive material.As previously discussed, the connector device can include an externalsurface for attachment to a complementary shaped surface. Thus, theconnector device can be used to attach one or more crimped conductors tothe complementary surface. Also, a portion of the conductor strip itselfcan be attached to a complementary shaped surface.

[0013] Generally, the bendable flaps can be bent inwards or towards eachother to crimp the conductor such as a flat conductive strip to theconnector device. More specifically, a connector device can be crimpedaround a lengthwise portion of a conductive strip to attach anotherconductor such as a distal end of a lead wire to the conductor strip.

[0014] The connector device can be made of electrically conductivemetal, although even a non-conductive material can be used to form theconnector device.

[0015] In one application, a conductor strip is positioned in a channelformed by bendable flaps and a lead wire is then crimped to theelongated conductor strip by bending the flaps inward. A portion of theflat conductor strip extending through the connector device can beformed or bent so that the flat conductive strip lies in a common planewith the external surface of the connector device.

[0016] One method of bending a portion of the flat conductive stripincludes applying a force on a portion of the conductive strip extendingbeyond an edge of the connector device so that at least a portion of theconductive strip generally lies flat lengthwise along a surface such asa planar or curved surface. Consequently, a flat conductive strip andbase of the connector device can lie in a common plane on acorresponding surface to which the entire assembly can be attached.

[0017] The conductive strip can be a braided wire with a solder core.Thus, an assembly including a connector device and braided wire lyingflat on a surface can be heated to melt the solder and attach thebraided wire and connector device to a corresponding complementaryshaped surface.

[0018] The complementary surface to which the braid wire is attached canbe a conductive layer disposed on glass or glass itself such as asurface of an automobile window. The conductor and connector assemblycan also be attached directly to glass or other surface using a solderprocess. Accordingly, a voltage can be applied to the conductive layerthrough a lead wire attached to the connector device.

[0019] An elongated conductor strip crimped in the connector device isoptionally a braided wire that is pre-soaked in previously heatedsolder. In such a case, the conductive strip and connector device can beaffixed to a complementary surface by melting the solder in the braid.

[0020] Generally, the conductor strip can be flexible so that it canconform to the shape of a complementary surface to which it iseventually attached. Accordingly, it is an easier task to secure anassembly including the conductor strip to a complementary surface.Preferably, the conductor strip is substantially similar to thecomplementary surface to which it is secured, but an exact matching ofcontoured surfaces is not necessary when the conductor is more flexible.That is, the conductor can be somewhat malleable so that it can beformed for attachment to a particular surface.

[0021] Spaced masses of solder can be attached along a length of anelongated conductor strip to which the connector device is crimped.Thereafter, heat can be applied to the elongated conductor and connectordevice to melt the solder masses for attaching the elongated conductorto a corresponding surface.

[0022] One application of the inventive combination of materials such asa lead wire attached to a conductor is a rear window of an automobile oreven glass itself. In such an application, a lead wire can be crimped toa conductor such as a braided wire via the connector device. Thiscombination of conductive strip and connector device can then besoldered to a heater or defroster strip disposed on glass. For example,a base of the connector device and conductive strip such as braided wirecan be soldered to a conductive layer disposed on a rear window of anautomobile. A lead wire can be crimped by the connector device tocontact the braid. The assembly can also be soldered directly to a glasswindow. Consequently, a voltage then can be applied to the heater stripvia a connection between the lead wire crimped to the connector device,which in turn is attached to the heater strip.

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The foregoing and other objects, features and advantages of theinvention will be apparent from the following more particulardescription of preferred embodiments of the invention, as illustrated inthe accompanying drawings in which like reference characters refer tothe same parts throughout the different views. The drawings are notnecessarily to scale, emphasis instead being placed upon illustratingthe principles of the invention.

[0024]FIG. 1 is a diagram of a connector device for attaching a leadwire to a conductor according to certain principles of the presentinvention.

[0025]FIG. 2 is a diagram of a crimped connector device attaching a leadwire to a conductor according to certain principles of the presentinvention.

[0026]FIG. 3 is a side view diagram of flattening a conductor accordingto certain principles of the present invention.

[0027]FIG. 4 is a diagram illustrating a connector device includingmultiple sets of bendable flaps according to certain principles of thepresent invention.

[0028]FIG. 5 is a diagram of a connector assembly for attaching a leadwire to a conductive strip according to certain principles of thepresent invention.

[0029]FIG. 6 is a diagram of a connector device including a tongue forattaching a wire lead according to certain principles of the presentinvention.

[0030]FIG. 7 is a cross-sectional diagram of a braided wire with fluxsolder core according to certain principles of the present invention.

[0031]FIG. 8 is a cross-sectional diagram of a flattened braided wirewith flux solder core according to certain principles of the presentinvention.

[0032]FIG. 9 is a diagram illustrating a method of attaching a conductorand wire lead to a complementary surface according to certain principlesof the present invention.

[0033]FIG. 10 is a diagram of attaching a conductor and lead wire toglass according to certain principles of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0034] A description of preferred embodiment follows.

[0035]FIG. 1 is a diagram illustrating an assembly for connecting a leadwire to a conductor strip according to certain principles of the presentinvention.

[0036] As shown, connector device 110 includes channel 120 formed bybendable flaps 115. Generally, bendable flaps 115 can be crimped or bentinward to secure any number of conductors. For example, lead wire 130including exposed wire strands 112 can be secured to conductor 140 bypositioning distal end of lead wire 130 and conductor 140 in channel 120and, thereafter, bending flaps 115 inward with a corresponding crimpingtool. Accordingly, a connector 150 of lead wire 130 can be electricallyconnected to conductor 140 through lead wire 130.

[0037] Although FIG. 1 illustrates a connection between a conductor 140such as a flat conductor strip such and lead wire 130, generally anytype of conductor strips can be secured to a complementary surface.

[0038] One aspect of the present invention concerns the shape ofconnector device 110. Generally, a surface of connector device 110 canbe shaped for attachment to a substantially complementary surface. Thatis, the shape of a surface of connector device 110 can have a surfacecontour that substantially matches that of a complementary surface towhich it is attached. For example, a base or bottom surface of connectordevice 110 can be flat so that it can be attached to a correspondingapproximately flat surface. According to this aspect of the invention,connector device 110 can be more easily attached to a complementarysurface via a strong solder bond.

[0039] In one application, connector device 110 is fabricated frommalleable metal such as copper or tinned copper so that connector device110 can be soldered to a complementary shaped surface such as metal orglass. As shown, conductor 140 can be a flat strip of metallic materialsuch as a braided wire so that assembly 100 generally has a planar shapealong bottom of conductor 140 and connector device 110. Consequently, aplanar surface of assembly 100 including base of connector device 110and surface of conductor 140 can be soldered to a complementary shapedsurface.

[0040]FIG. 2 is a diagram of a conductor attached to a lead wireaccording to certain principles of the present invention.

[0041] As previously discussed, wire strands 112 at distal end of leadwire 130 can be crimped to conductor 140. Solder masses 210 such asstrips of solder with a flux core can be attached or crimped along alength of conductor 140. Typically, solder masses 210 are spaced at aspecified distance such as length, L, apart from each other. Soldermasses 210 need not include a flux core.

[0042] When used, the addition of the spaced solder masses 210 rendersit easier to solder assembly 200 to a corresponding surface. Forexample, conductor 140 can be soldered to a complementary surface byheating conductor 140 and solder masses 210 accordingly. Thus, apredetermined mass of solder can be melted to provide a solderconnection between conductor 140 and underlying surface. Also, crimpingsolder masses 210 along a length of the conductor simplifies thesoldering process since an extra hand is no longer necessary to hold thesolder in close proximity to the conductor 140. Rather, the soldermasses can be attached to conductor 140. Based on this aspect of theinvention, assembly 200 can be more easily soldered to a complementarysurface such as a planar surface area of glass.

[0043] Solder masses 210 can include a flux core or an external dab offlux (between solder mass 210 and conductor 140) can be provided so thatthe melted solder flows more easily during the attachment process. Inone embodiment, the solder masses themselves do not include flux intheir core. However, when solder masses 210 do include flux in theircore, the end of solder masses 210 are preferably tapered so that asubstantial amount of the flux remains within the core of a solder mass210 when it is crimped to conductor 140.

[0044] Another aspect of the present invention involves shapingconductor 140 so that it can be attached to a complementary surface. Forexample, a portion of conductor 140 extending through crimped portion ofconnector device 110 is bent near sections 220 so that bottom portion ofconnector device 110 and conductor 140 are generally flat along theirlength. This is shown in more detail in FIG. 3.

[0045]FIG. 3 is a side view diagram illustrating a process of bending aconductor according to certain principles of the present invention.

[0046] To shape conductor 140, a force is applied via stamp 310 so thatconductor 140 and connector device 110 generally lie flat or form acontoured surface. Consequently, assembly 200 can be more easilyattached to a complementary surface. Of course, conductor and/or bottomsurface of connector device 110 can be shaped for attachment to anyshaped surface contour.

[0047] As shown, a conductor 140 and connector device 110 can be formedfor attachment to a particular surface contour. For instance, a portionof conductor 140 such as a conductor strip can be bent or formed so thatan external surface of connector device 110 and a portion of conductor140 conform to a selected contour. One such selected contour is a flatsurface of glass. Notably, conductor 140 can be flexible so thatconductor 140 conforms to a complementary surface with minimal effort.

[0048]FIG. 4 is a diagram of a connector device including multiple setsof bendable flaps according to certain principles of the presentinvention.

[0049] As shown, connector device 405 includes sets of bendable flaps410 spaced apart from each other. Thus, flaps 410 can form correspondingchannels 430, 431. Each set of bendable flaps 410 can secure individualconductors to a common electrical node when crimped. It is, therefore, asimpler task to attach multiple conductors such as lead wires toconnector device 405. For example, the conductors can be attached atdifferent times.

[0050] One method of fabricating connective device 405 is to cut an ‘H’shaped pattern out of a flat strip of metal. Thereafter, flaps 410 canbe bent so that they are substantially perpendicular to base 420,potentially forming a surface of connector device 405 that can beattached to a complementary shaped surface. For example, a flat base 405can be formed for attaching connector device 430 to a complementarysurface.

[0051]FIG. 5 is a diagram illustrating a device for attaching multipleconductors according to certain principles of the present invention. Asdiscussed, flaps 410 can be crimped to connect multiple lead wires 130to connector device 405 and, more specifically, conductor 140.

[0052] Assembly 500 optionally includes serially disposed electricalcomponent 510 such as a resettable fuse and connector 550.

[0053]FIG. 6 is a diagram of a connector device including an extensionfor attaching a conductor such as a lead wire according to certainprinciples of the present invention.

[0054] Many features of connector device 610 have been discussed inprevious embodiments as discussed. However, device 610 also includes abase extension 620 and tongue 630 such as a protruding portion of metal.In the embodiment shown, tongue 630 is formed so that a conductor suchas connector 635 can be attached to a portion of tongue 630 disposed ata height, H, above extension 620. Extension 620 is optional and tongue630 generally can be connected to any portion of connector device 610.For example, extension 620 itself can be shaped to form a male connectorfor attaching a lead such as connector 635.

[0055]FIG. 7 is a pictorial view of a conductor according to certainprinciples of the present invention. As shown, a combination ofmaterials can be used to form a conductor including a wire braid 740with flux solder core.

[0056] Solder wire 720 with a flux core 730 is first provided. Strandsof wire are knitted about the outside of the solder wire 720 to producea braid of wire 710 hugging the outer surface of solder wire 720.Alternatively, a solder wire 720 may be passed through the center of apre-assembled hollow wire braid 710. The resulting solder-filled braid740, regardless of the assembly method, resembles a metallic sleeve thatruns the length of the overall solder wire 720.

[0057] The term “solder” has been used and will be used throughout thisspecification. It should be noted that this term includes suitablesubstantially pure metals such as lead or tin as well as solder,commonly so-called, and other fusible alloys or compositions that servethe same purpose. Additionally, “flux” refers to material that aids inthe fusion process.

[0058] According to another embodiment of the present invention, asolder strip 720 is flattened on a braid or within a braid to produce atleast a two layer structure including an unmelted flat bead of solder ona single or double layer of braided wire. A cross section of the picturein FIG. 8 shows a combination of solder 720 and flux 730 on a single ordouble layer braid of wire 730.

[0059] A composition of material by weight, i.e., solder versus braidedwire, can be tailored depending on the particular application. Forexample, some applications require more solder by weight than braidedwire, in which case a larger mass, or diameter, of solder is provided atthe solder core. Additionally, the thickness of the wire strands orthickness of the overall knitted braid of wire can be tailored dependingon the application.

[0060] It should be noted that the aforementioned method of combiningmaterials to create a braided wire 740 with a solder core advantageouslyenables one to achieve very high levels of solder content. For example,it is possible to achieve a mixture of greater than 90% solder and lessthan 10% braid by weight. Alternative methods, such as pre-soldering thebraid, generally cannot produce a braid of wire impregnated with morethan 41% solder by total weight. Hence, during the solder process, theinventive combination of material does not require the laborious task ofadding solder to the braided strip to achieve a higher percentage ofsolder by weight as is required for a pre-soldered version. Rather, thepresent invention advantageously provides the correct solder content atits core prior to the solder process. Overheating of an underlyingsubstrate is avoided because there is no need to add more solder to thesurface during the soldering process.

[0061] In the preferred embodiment, the combination of flux 730, solder720 and braid of wire 710 is flattened with a rolling device to producea flat wire braid 850 with flux solder core as shown in FIG. 8. Becausethe solder 720 core is generally malleable, the strands of wire in thebraid of wire 710 become embedded in the softer solder 720 materialduring the flattening process. This flattened braided wire with fluxsolder core 850 can be used as conductor 140 that is crimped intoconnector device 110, 405 via bendable flaps 115, 410 as shown in FIGS.1 and 4.

[0062] Referring again to FIG. 8, the combination of solder 720 andbraid of wire 710 is flattened for a number of reasons. First, embeddingthe strands of wire in the solder 720 serves to increase the surfacecontact between the solder 720 and braid of wire 710, thereby enhancingthe thermal conductivity between the two materials, i.e., heat flowsmore easily from the braided wire in contact with the solder core. Whenthe braid of wire is heated by pressing a hot soldering iron to itsouter surface, the heat easily transfers to the core solder wire 720because of the increased surface area contact between the strands ofwire and solder core 720. When the solder core melts, the solder iseasily absorbed by the braided wire facilitating the fusion of thebraided wire to a conductive node.

[0063] Additionally, the combination of material is flattened to producea flat wire braid 850 because this shape conforms to most conductiveelectrical node surfaces, which are usually flat or slightly curvedsurfaces. For example, to create a good solder connection between twoconductive materials, both materials generally conform to each other sothat both materials become sufficiently heated during the solderprocess. In fact, it can be necessary to sufficiently heat theconductive strips to avoid creating cold solder joints. Preferably, thetwo conductive materials touch during the heating process because meltedsolder adheres and flows based on capillary action. Therefore, bettersolder joints can be created when the surface area of the materials tobe bonded are in close proximity to each other.

[0064]FIG. 9 shows a method of soldering a conductor 140 such as a stripof flat wire braid 850 with flux solder core to a conductive strip 920adhered to a glass substrate 930. Any of the connective assemblies aspreviously discussed also can be attached directly to glass or othercomplementary surface.

[0065] Heat can be applied directly to the surface of the conductor 140at one or multiple points to bring the temperature of the solder core upto its melting point. More specifically, one or multiple heat sources900 can be used at different positions along the conductor so that aconductor strip is more easily soldered to strip 920. Notably, conductor140 can include spaced masses of solder 210 as previously discussed.

[0066] A substantial portion of the heat can travel down the length ofthe solder core, rather than through opposing side of the braided wireto the conductive strip 920 adhered to the glass substrate 930.Effectively, conductive strip 920 and glass 930 can be buffered from thehot solder core by the layer of braided wire, until the solder melts andforms a connection between conductor 140 and strip 920. Accordingly,underlying glass 930 is not severely heated during the initial phases ofthe solder process. As mentioned, conductor 140 and connector device 110also can be attached directly to glass 930.

[0067] Around the time when the solder core reaches its meltingtemperature at the tip of heat source 900, so does the entire length ofthe solder core in the braided wire strip 850 because of the highthermal conductivity of the solder core, i.e., the solder core is onesolid strip. In some respects, the underlying conductive strip 920 isshielded from severe heat because the solder core has a higher thermalconductivity. Hence, a substantial amount of heat generally passes downthe solid core prior to melting.

[0068] When braided wire with solder core is used, the solder core meltsand changes to a liquid. It is then typically absorbed into the outerwalls of the braided wire 850 where heat is then transferred verticallyto the underlying conductive strip 920. Because conductive strip 920 isnow in direct contact with the braided wire strip 850 filled with moltensolder, it experiences an instant rise in temperature. As a result, thesolder flows freely onto the surface of the conductive strip 920 orwindow pane 930 to form a reliable solder joint when the heat source isremoved and the area is cooled.

[0069] This method of attaching a braided wire strip 850 or conductor140 including connector device 115 to conductive strip 920 reduces andevenly distributes heat that is transferred to glass substrate 930during the soldering process. Effectively, a substantial portion of heatimparted by heat source 900 is initially transferred horizontally, orlengthwise, along the braided wire 850 until the solder core melts atwhich point the heat is then transferred vertically to the conductivestrip 920. Although glass 930 is exposed to heat, the aforementionedmethod is superior to other methods which transfer heat in asubstantially vertical direction throughout the soldering process. As aresult, the present invention can be used to avoid creating severe “hotspots” in glass 930 that can cause structural damage.

[0070] Another advantage of the present invention is the visual cluethat indicates when to stop heating the braided wire 850. A techniciancan note that heat source 900 such as a solder iron should be removed byobserving when the solder core changes to a liquid and is absorbed bythe braided wire. Because the conductive strip is in contact withbraided wire 850, the solder can flow to conductive strip 920 fusing thetwo conductors when the region is cooled. In general, these visual cluesindicate that a good solder contact has been formed between braided wire850 and underlying conductive strip 920 on glass 930. At this point, orsoon thereafter, the technician knows to remove heat source 900 to avoidunnecessarily overheating underlying glass 930.

[0071] The inventive method of soldering braided wire 850 or a conductor140 to a conductive strip 920 over a glass substrate 930 has a morefavorable failure mode than other suggested methods. It requires moreforce to separate the braid from the glass using the adhesion process ofthe present invention. In particular, it generally requires 15 pounds ofpull on the braid 850 to tear it from the conductive strip 920 or glass930.

[0072] Based on other suggested methods such as soldering a pre-solderedbraid to a conductive strip adhered to a glass, applying a 5 pound pullon the braid of wire causes the conductive strip to separate from themain piece of glass. Essentially, the effect of heating the glass is sosevere using other methods that the structurally damaged glass seversfrom the main piece of glass before the adhesive solder between thebraid and conductive strip separates. Typically, shards of broken glasscling to the conductive strip during the separation process destroyingthe underlying window. The failure mode of the present invention,therefore, is preferred because there is no damage to the glass and thesoldered braid can withstand a greater pulling force.

[0073] One application involves soldering a conductor 140 such as abraided wire 850 to opposing ends of the defroster heating elements on arear window 1000 of an automobile. For example, see the illustration inFIG. 10. Manufacturers of rear windows 1000 generally provide parallel,horizontal resistive strips 1010 that produce heat when a voltagepotential is applied across each end at location 1050 and 1060. Inshort, the voltage difference 1040 along lengthwise portion of resistivestrips 1010 causes current to flow through the resistive strips 1010,thus creating a mild heat source when switch 1030 is turned on.

[0074] At some point in the manufacturing process, one or multiple wires1070 and 1080 must be routed to the vertically positioned buses locatedat 1050 and 1060 on the left and right side of the rear window 1000.Initially, a braid of wire with a flux solder core 1020 can be cut tolength and soldered to the resistive strip on the glass at opposing ends1050 and 1060. This solder process is described above and illustrated inFIG. 9. The length of the braid 1020 now serves as a highly conductivepath where little, if any, heat is dissipated near braid of wire 1020 orconductor 140. Heat can be generated in the middle of the window meltingsnow or ice along the resistive strips 1010 where a driver is mostinterested, rather than at the opposing edges located at 1050 and 1060.In other words, the overlaying soldered braid wire 1020 on the widevertical resistive strips located at 1050 and 1060 tremendouslyincreases current carrying capacity in that region and thereby reducesundesirable heat loss.

[0075] A connector device can be soldered along with conductor 140 tothe wide vertical resistive strips at either ends located at 1050 and1060. This is a means by which voltage 1040 can be applied across thehorizontal resistive heater strips 1010. Effectively, the braided wire1020 or conductor 140 can serve as a strong structural support for thewire connector where forces on the electrical connector 1070 or 1080 aredistributed along the length of conductor 140. As a result, theconnector and supporting strip of braid wire are less likely to bedamaged by a mechanic pulling on the wire to disconnect it from thewindow assembly. A close up view of the electrical connector 1070 and1080 can be found in FIG. 9 that alternatively shows a side view of theelectrical connector 960 and current carrying wire 950.

[0076] While this invention has been particularly shown and describedwith references to preferred embodiments thereof, it will be understoodby those skilled in the art that various changes in form and details maybe made therein without departing from the spirit and scope of theinvention as defined by the appended claims.

What is claimed:
 1. A method of producing a device for securingconductors, the method comprising the steps of: shaping a connectordevice to include bendable flaps for securing a conductor; and formingthe connector device to include an external surface that is eventuallyaffixed to a substantially complementary shaped surface, at least aportion of the conductor secured in the connector device also beingaffixed to the substantially complementary shaped surface, the conductorbeing bent near the connector device in a manner so that at least aportion of the conductor and the external surface of the connectordevice lie in a common contour.
 2. A method as in claim 1, wherein theexternal surface is substantially flat and at least a portion of theconductor and external surface lie in a common plane.
 3. A method as inclaim 1 further comprising the steps of: providing a strip of flatmetal; and bending the strip of flat metal to form the bendable flaps ofa connector device, a portion of the strip of flat metal forming theexternal surface that is eventually attached to the complementarysurface.
 4. A method as in claim 1, wherein the connector deviceincludes two or more sets of bendable flaps.
 5. A method as in claim 1,wherein the connector device is electrically conductive.
 6. A method asin claim 1, wherein the external surface of the connector device issoldered to a complementary shaped surface.
 7. A method as in claim 1,wherein a lead is crimped to the conductor via the connector device. 8.A method as in claim 1 further comprising the step of: shaping theconnector device to include a tongue for attaching a lead wire.
 9. Amethod as in claim 8, wherein a lead wire can be removably attached tothe tongue.
 10. A method as in claim 9, wherein the tongue is disposedabove a corresponding surface to which the connector device is attached.11. A method of attaching conductors comprising the steps of: providinga connector device having bendable flaps for securing a conductor stripwhen the flaps are crimped, the connector device including an externalsurface for attachment to a substantially complementary shaped surface;crimping at least a portion of the conductor strip to the connectordevice by bending the flaps; and attaching the connector device and atleast a portion of the conductor strip to the substantiallycomplementary surface, the conductor being bent near the connectordevice in a manner so that at least a portion of the conductor and theexternal surface of the connector device lie in a common contour.
 12. Amethod as in claim 11, wherein the step of crimping further comprises:bending the set of flaps of the connector device inwards towards eachother to secure a lead wire to the conductor strip.
 13. A method as inclaim 11, wherein the connector device is crimped around a lengthwiseportion of the conductor strip to attach a distal end of a lead wire tothe conductor strip.
 14. A method as in claim 11, wherein the connectordevice is electrically conductive.
 15. A method as in claim 11 furthercomprising the steps of: disposing a lead wire above the conductor stripand thereafter crimping the flaps of the connector device to attach thelead wire to the conductor strip; and bending a portion of the conductorstrip extending through the connector device such that at least aportion of the conductor strip lies in a common plane with the externalsurface of the connector device.
 16. A method as in claim 15, whereinthe step of bending a portion of the conductor strip includes applying aforce on a portion of the conductor strip extending beyond an edge ofthe connector device.
 17. A method as in claim 11, wherein the conductorstrip includes a braided wire.
 18. A method as in claim 11, wherein theconductor strip comprises a braided wire with a solder core.
 19. Amethod as in claim 11 further comprising the steps of: contacting theexternal surface of the connector device to the complementary shapedsurface; and applying heat to the connector device for soldering theconnector device to the complementary shaped surface.
 20. A method as inclaim 19, wherein the complementary shaped surface is a layer of glass.21. A method as in claim 11 further comprising the step of: applyingheat to the conductor strip and connector device for attachment toglass.
 22. A method as in claim 11 further comprising the step of:bending the flaps of the connector device to crimp a lead wire to abraid of wire.
 23. A method as in claim 22 further comprising the stepsof: heating the braid of wire; and applying solder to the braid of wire.24. A method as in claim 11 further comprising the step of: attachingindividual solder masses along the conductor strip.
 25. A method offorming an assembly comprising: providing a conductor; securing aconnector device to the conductor by crimping bendable flaps extendingfrom the connector device, the connector device having an externalsurface; and bending the conductor near the connector device in a mannerso that at least a portion of the conductor and the external surface ofthe connector device lie in a common contour for attaching to a surface.